Semiconductor Polishing Slurry offers a range of polishing processes and consumables specifically designed for compound semiconductors like silicon carbide, aluminum nitride, gallium nitride, gallium arsenide, indium phosphide, and more. Additionally, the company provides various types of OEM services to meet customers' specific needs.
One of the latest products from Hans is the new series of AO polishing slurry, which has been professionally developed for back polishing of InP & GaAs Chips. Compared to Logitech Slurry, the AO Polishing slurry offers a high removal rate, better surface flatness (Ra, TTV, LTV), and a high qualification rate.
This slurry is widely used in InP Chip and GaAs Chip back polishing, and the recommended polishing process for InP&GaAs Logitech Polisher is as follows:
First Step: Thinning, 15-30min: Use 3-10um Aluminum oxide Powder & Quartz Plate.
Second Step: Backing polishing, 30-40min: Use InP: AO-1/3-20 Aluminum oxide  polishing Slurry together with PU polishing Pad. For GaAs, use AO-1/3-20 Aluminum oxide  Polishing Slurry, AO-1/5-10 Aluminum oxide  Polishing Slurry, or SO-80-PF CMP Polishing Slurry together with PU polishing Pad.
Hans Semiconductor polishing Slurry is a reliable and efficient solution for compound semiconductor polishing, and the company's commitment to providing high-quality products and services makes them a top choice for customers in the industry.
Features
Hans new series of AO polishing slurry is professionally developed for back polishing of InP & GaAs Chips.  Compared to Logitech Slurry, It features high removal rate, better surface flatness (Ra, TTV, LTV), high qualification rate.
Applications
Widely used in InP Chip and GaAs Chip back polishing.
Recommend polishing process for InP&GaAs
Logitech Polisher
First Step: Thinning, 15-30min：3-10um Aluminum oxide  Powder & Quartz Plate； 
Second Step: Backing polishing：30-40min：
InP: AO-1/3-20  Aluminum oxide polishing Slurry together with PU polishing Pad
GaAs: AO-1/3-20 Aluminum oxide Powder polishing Slurry , OrAO-1/5-10  Aluminum oxide  polishing Slurry or SO-80-PF CMP polishing Slurry together with PU polishing Pad