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CMP slurry

​CMP slurry
The CMP slurry is made from colloidal raw materials and is designed with unique formulas that cater to different polishing materials. Our slurry guarantees that the pH value remains almost unchanged during the polishing process, which ensures a stable polishing rate and saves time. Our CMP polishing slurry is widely used for various nanoscale materials' chemical mechanical polishing, including sapphire material, silicon, stainless steel, aluminum magnesium alloy, compound crystal, and more.
Our CMP slurry is the ideal solution for achieving high-quality polishing results, thanks to its exceptional performance and stability. The slurry's unique formula ensures that the pH level remains constant during the polishing process, which helps to maintain a stable polishing rate and significantly reduces the time required for polishing.
Our CMP polishing slurry is extensively used in the polishing of nanoscale materials, including sapphire material, silicon, stainless steel, aluminum magnesium alloy, and compound crystal. With our high-quality CMP slurry, you can expect nothing but the best results when it comes to polishing your materials.
In conclusion, our CMP slurry is the perfect choice for those who want to achieve high-quality polishing results quickly and efficiently. With its unique formula and exceptional performance, our slurry is the go-to solution for polishing a wide range of nanoscale materials. So why wait? Try our CMP polishing slurry today and experience the difference for yourself!
Features
1. Uniform particle size. (narrow distribution, spherical surface);
2. High polishing rate. (special formula. pH value is stable);
3. High flatness. (surface quality Ra<0.2nm TTV<3u);
4. High Cycling life;
5. Low-temperature polishing available. (Under 35℃);
6. Improved type for Silicon Carbide substrate;
7. Neutral or Weak acid polishing slurry for Aluminum Nitride heat dissipation substrate.
Applications
1. Silicon  carbide substrate
2. Sapphire material
3. Stainless  steel
4. Optical glass & crystal
5. Aluminum nitride heat dissipation substrate
​CMP slurry
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